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Single Crystal Substrate Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Single Crystal Substrate Product List

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SrTiO3 single crystal substrate (STO substrate)

The SrTiO3 (STO) substrates from Shinko Electric Industries are a long-selling product that is beloved by thin film researchers around the world.

The SrTiO3 (STO) substrates from Shinko Electric Industries have been a long-selling product favored by thin film researchers worldwide since the 1980s. We also offer options such as Nb-doped products with conductivity, step and terrace treatment, and break groove (chocolate bar-shaped) processed items.

  • Company:信光社
  • Price:Less than 10,000 yen
  • Ceramics

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[Processing Results] Large-scale LBO Single Crystal Substrate

The distortion of the wavefront achieved an excellent polishing precision of 0.26μm! We have successfully processed the polishing of LBO single crystal substrates.

This is an introduction to the polishing processing results of the "large LBO single crystal substrate" (100×100×1.5mm). The disturbance of the transmitted wavefront achieves an excellent polishing accuracy of 0.26μm. We have successfully polished the LBO single crystal substrate, which is used in the LFEX laser. 【Overview】 ■ Shape accuracy: PV0.26μm, Measurement device: Zygo Verifire ATZ ■ Surface roughness: Sa0.44nm, Measurement device: Zygo NewView 8300 ■ Substrate size: 100×100×1.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Single Crystal Substrate Crystals: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials

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Low-damage processing and polishing processes and evaluation of SiC and GaN wafer substrates.

Latest polishing technology for various GaN/SiC related materials with high hardness and brittleness.

★What does the future hold for technologies that support large-diameter processing and mass production techniques? ★We will also introduce the characteristics of the residual processing altered layer remaining during SiC wafer processing, its impact on subsequent processes, and analysis techniques for the altered layer. ★We are currently conducting a pre-content request service! We welcome your practical challenges! 【Venue】 Tekno Kawasaki, 5th Floor, 5th Training Room【Kanagawa, Kawasaki】 【Date and Time】 September 17, 2013 (Tuesday) 11:00-15:45 【Instructors】 Part 1: Dr. Tomohisa Kato, Team Leader and Senior Researcher, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Here is the homepage of the Advanced Power Electronics Research Center. Part 2: Representative from Namiki Precision Jewel Co., Ltd., NJC Technology Research Institute Part 3: Professor Kazuto Yamauchi, Graduate School of Engineering, Osaka University

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

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